Nanoglue
Nanoglue is a specially designed adhesive that is made to bond almost any kind of material that could be found today. It is mainly based on the concept of utilizing a substance that contains nanoscale chains capable of arranging or assembling themselves.
Compared to other relevant materials, nanoglue tends to be cheaper to produce. In the instance that the nanoglue has been set, it would be able to withstand temperatures that are high enough to destroy or ruin other similar materials used in comparable applications. The said adhesive's molecular bonds would even grow stronger when significant amounts of heat are applied.
Although this type of material has long been available in the market, it has only been recently discovered that the bonding strength of the material could greatly be increased by applying significant amounts of heat. It also has been found out that the material could have good heat-resisting potential.
The History of Nanoglue
Nanoglue technology started off as an ordinary self-assembling molecular nanolayer with adhesive properties that had not much promise. After it has been heated to around 400 degrees Celsius, the bonds and the chain of the nanolayer starts to weaken and collapse.
In the hopes of strengthening the bonds of the nanolayer, G. Ramanath and company tried a new approach in the production of the nanolayer as an adhesive. Since the weak thermal properties of the existing nanolayer have made a limitation on the usefulness and applications of the nanoglue in industries, they thought of a way of strengthening the bonds. They sandwiched the nanolayer between layers of silica and copper. This ultimately led to a very important discovery on how to strengthen the nanolayer's bonds and to increase its thermal resistance.
How Nanoglue Works
This method involves a self-assembled molecular nanolayer. The said nanolayer is placed between a layer of silica and a thin copper film. This process increases the adhesion strength of the bonds and reinforces the nanolayer's chains. In fact, the copper-silica layers increase the adhesive strength of the nanolayer significantly by up to seven times its usual strength
This newly-formed structure also makes the nanolayers capable of resisting great temperatures. As the nanolayer sandwich is exposed to more and more heat, the stronger the bonds grow. The copper and silica layers act as constraints against disintegration.
Applications of Nanoglue
Nanoglue technology could be used in a wide variety of applications due to its adhesive strength, its ability to resist heat and the low cost of its production.
Nanoglue could find good use in applications where surfaces that needs to be bonded are constantly exposed to extreme temperatures – say, the inside surface of jet engines. Another good use of the nanoglue is in the semiconductor and computer industry. This is primarily due to the relatively small thickness required by the glue (less than one nanometer) and because of its good thermal resistance.
Finally, since the production of such product is significantly low (about $35 per 100 grams), it could readily be used and sold in the market.
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